2025-03-04 13:21:59
Since the advent of the first laser in the 1960s, laser technology has been continuously developed, and a variety of types of lasers have been derived, which are widely used in medical, communication, optical storage and other fields. After entering the 21st century, ultrafast laser technology developed rapidly, and gradually gave birth to picosecond, femtosecond and attosecond lasers. However, the attosecond laser is still in the laboratory research stage due to its high cost and has not been applied on a large scale.
In the slicing process of silicon carbide (SiC) ingot, the traditional mechanical cutting method is still the mainstream of the industry. In order to improve processing quality and efficiency, researchers are constantly coming up with innovative methods to try to combine advanced processes with traditional cutting techniques, improve tool performance, or develop new processing processes. For example, Hiroto Maeda et al. successfully achieved a high speed cutting rate of 0.6 mm per minute by combining a high-speed multi-wire saw with electroplated diamond wire for cutting SiC ingot.